Heterogeneous Integration (2.5D and 3D) Integrated 3D Systems Group
Heterogeneous Integration Roadmap. Driving force and enabling technology for systems of the future. Chapter 23 wafer level packaging.
Web chapter 21 sip and module. Web heterogeneous integration roadmap summary introduction and brief history of the semiconductor technology. Driving force and enabling technology for systems of the future. Chapter 22 interconnects for 2d & 3d. Chapter 23 wafer level packaging.
Web heterogeneous integration roadmap summary introduction and brief history of the semiconductor technology. Web chapter 21 sip and module. Driving force and enabling technology for systems of the future. Web heterogeneous integration roadmap summary introduction and brief history of the semiconductor technology. Chapter 22 interconnects for 2d & 3d. Chapter 23 wafer level packaging.
